In many cases, engineers need to use fluid analysis and structural analysis together — calculate the thermal stress of an electronic board; examine the stress on a plane’s wing; investigate influence of wind or fire on architectures.
One way FSI (Fluid Structure Interaction) is developed to facilitate these situations. Analysis results of fluid analysis (temperatures, pressures) can be automatically applied to structural analysis as analysis conditions.
3 major changes enhance the MBD in midas NFX:
Most failures of electric products occur because of heat and stress generated from electricity. When electric current passes through a semi-conductor, heat energy is generated and temperatures at certain spots become too high. Without being discovered and dealt with at the design stage, this problem will lead to costly redesign or even product failure.
Joule heating calculates heat energy generated during the passage of electric current through a semi-conductor. It helps designers to spot the overheated areas and make proper improvements to their designs.
Many industrial equipment and processes involve fluid and particles in one system, where engineers want to understand the interaction between particles and the fluid. Typical applications include filtration, solid-liquid mixing, spray coating, etc.
With the newly implemented particle analysis, you can analyze the movements of particles inside the fluid and their interactions with the fluid.